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1

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li, Xing-Chang Wei, Cangellaris, A.C., En-Xiao Liu, Yao-Jiang Zhang, D'Amore, M., Joungho Kim, Sudo, T.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2010

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2010

2

A methodology for fast finite element modeling of electrostatically actuated MEMS

Prasad S. Sumant, Narayana R. Aluru, Andreas C. Cangellaris

Journal:

International Journal for Numerical Methods in Engineering

Année:

2009

Langue:

english

Fichier:

PDF, 280 KB

english, 2009

3

Effective permittivities for second-order accurate FDTD equations at dielectric interfaces

Kyu-Pyung Hwang,, Cangellaris, A.C.

Journal:

IEEE Microwave and Wireless Components Letters

Année:

2001

Langue:

english

Fichier:

PDF, 68 KB

english, 2001

4

A new discrete transmission line model for passive model order reduction and macromodeling of high-speed interconnections

Cangellaris, A.C., Pasha, S., Prince, J.L., Celik, M.

Journal:

IEEE Transactions on Advanced Packaging

Année:

1999

Langue:

english

Fichier:

PDF, 281 KB

english, 1999

5

A Reflectionless Sponge Layer Absorbing Boundary Condition for the Solution of Maxwell's Equations with High-Order Staggered Finite Difference Schemes

Peter G. Petropoulos, Li Zhao, Andreas C. Cangellaris

Journal:

Journal of Computational Physics

Année:

1998

Langue:

english

Fichier:

PDF, 372 KB

english, 1998

6

A hybrid spectral/FDTD method for the electromagnetic analysis of guided waves in periodic structures

Cangellaris, A.C., Gribbons, M., Sohos, G.

Journal:

IEEE Microwave and Guided Wave Letters

Année:

1993

Langue:

english

Fichier:

PDF, 290 KB

english, 1993

7

Finite-Thickness Conductor Models for Full-Wave Analysis of Interconnects With a Fast Integral Equation Method

Morsey, J.D., Okhmatovski, V.I., Cangellaris, A.C.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2004

Langue:

english

Fichier:

PDF, 612 KB

english, 2004

8

Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

Coperich Branch, K.M., Morsey, J., Cangellaris, A.C., Ruehli, A.E.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2002

Langue:

english

Fichier:

PDF, 621 KB

english, 2002

9

A quasi three-dimensional distributed electromagnetic model for complex power distribution networks

Myoung Joon Choi,, Cangellaris, A.C.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2002

Langue:

english

Fichier:

PDF, 454 KB

english, 2002

10

Rules for robust generation of accurate reduced-order models for high-speed coupled interconnections

Cangellaris, A.C., Igarashi, M.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2001

Langue:

english

Fichier:

PDF, 120 KB

english, 2001

11

An all-purpose dispersive multiconductor interconnect model compatible with PRIMA

Pasha, S., Cangellaris, A.C., Prince, J.L.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2001

Langue:

english

Fichier:

PDF, 103 KB

english, 2001

12

Comprehensive broad-band electromagnetic modeling of on-chip interconnects with a surface discretization-based generalized PEEC model

Aosheng Rong,, Cangellaris, A.C., Limin Dong,

Journal:

IEEE Transactions on Advanced Packaging

Année:

2005

Langue:

english

Fichier:

PDF, 690 KB

english, 2005

13

Influence of a floating plane on effective ground plane inductance in multilayer and coplanar packages

Lopez, M., Prince, J.L., Cangellaris, A.C.

Journal:

IEEE Transactions on Advanced Packaging

Année:

1999

Langue:

english

Fichier:

PDF, 580 KB

english, 1999

14

A stretched coordinate technique for numerical absorption of evanescent and propagating waves in planar waveguiding structures

Gribbons, M.A., Pinello, A.P., Cangellaris, A.C.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

1995

Langue:

english

Fichier:

PDF, 701 KB

english, 1995

15

Sensitivity analysis of multiconductor transmission lines and optimization for high-speed interconnect circuit design

Cheng Jiao,, Cangellaris, A.C., Yaghmour, A.M., Prince, J.L.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2000

Langue:

english

Fichier:

PDF, 192 KB

english, 2000

16

[IEEE 2016 IEEE/MTT-S International Microwave Symposium (IMS) - San Francisco, CA (2016.5.22-2016.5.27)] 2016 IEEE MTT-S International Microwave Symposium (IMS) - Correlation Transmission Line Matrix (CTLM) modeling of stochastic electromagnetic fields

Russer, Johannes A., Cangellaris, Andreas, Russer, Peter

Année:

2016

Langue:

english

Fichier:

PDF, 3.52 MB

english, 2016

17

A node-based agglomeration AMG solver for linear elasticity in thin bodies

Prasad S. Sumant, Andreas C. Cangellaris, Narayana R. Aluru

Journal:

International Journal for Numerical Methods in Biomedical Engineering

Année:

2009

Langue:

english

Fichier:

PDF, 545 KB

english, 2009

18

A conformal mapping-based approach for fast two-dimensional FEM electrostatic analysis of MEMS devices

Prasad S. Sumant, Andreas C. Cangellaris, Narayana R. Aluru

Journal:

International Journal of Numerical Modelling: Electronic Networks, Devices and Fields

Année:

2011

Langue:

english

Fichier:

PDF, 307 KB

english, 2011

19

Passive reduced-order modeling of electromagnetic systems

Andreas C. Cangellaris, Li Zhao

Journal:

Computer Methods in Applied Mechanics and Engineering

Année:

1999

Langue:

english

Fichier:

PDF, 1.05 MB

english, 1999

20

A novel method of measuring microelectronic interconnect transmission line parameters and discontinuity equivalent electrical parameters using multiple reflections

Abernethy, C.E., Cangellaris, A.C., Prince, J.L.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Année:

1996

Langue:

english

Fichier:

PDF, 836 KB

english, 1996

21

Electromagnetic model order reduction for system-level modeling

Cangellaris, A.C., Celik, M., Pasha, S., Li Zhao,

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

1999

Langue:

english

Fichier:

PDF, 185 KB

english, 1999

22

A Finite-Element Domain-Decomposition Methodology for Electromagnetic Modeling of Multilayer High-Speed Interconnects

Hong Wu, Cangellaris, A.C.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2008

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2008

23

Time-domain finite-element methods

Jin-Fa Lee, Lee, R., Cangellaris, A.

Journal:

IEEE Transactions on Antennas and Propagation

Année:

1997

Langue:

english

Fichier:

PDF, 478 KB

english, 1997

24

Time-domain finite methods for electromagnetic wave propagation and scattering

Cangellaris, A.C.

Journal:

IEEE Transactions on Magnetics

Année:

1991

Langue:

english

Fichier:

PDF, 628 KB

english, 1991

25

Application of the measured equation of invariance to electromagnetic scattering by penetrable bodies

Cangellaris, A.C., Wright, D.B.

Journal:

IEEE Transactions on Magnetics

Année:

1993

Langue:

english

Fichier:

PDF, 434 KB

english, 1993

26

Enhanced skin effect for partial-element equivalent-circuit (PEEC) models

Coperich, K.M., Ruehli, A.E., Cangellaris, A.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2000

Langue:

english

Fichier:

PDF, 865 KB

english, 2000

27

Effects of floating planes in three-dimensional packaging structures on simultaneous switching noise

Vakanas, L., Hasan, S., Cangellaris, A., Prince, J.L.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Année:

1998

Langue:

english

Fichier:

PDF, 308 KB

english, 1998

28

On deembedding of port discontinuities in full-wave CAD models of multiport circuits

Okhmatovski, V.I., Morsey, J., Cangellaris, A.C.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2003

Langue:

english

Fichier:

PDF, 531 KB

english, 2003

29

Efficient transient simulation of lossy packaging interconnects using moment-matching techniques

Celik, M., Cangellaris, A.C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Année:

1996

Langue:

english

Fichier:

PDF, 1.01 MB

english, 1996

30

[IEEE IEEE MTT-S International Microwave Symposium - IMS 2003 - Philadelphia, PA, USA (8-13 June 2003)] IEEE MTT-S International Microwave Symposium Digest, 2003 - De-embedding of port discontinuities in full-wave CAD models of multi-port circuits

Okhmatovski, V.I., Morsey, J., Cangellaris, A.C.

Année:

2003

Langue:

english

Fichier:

PDF, 249 KB

english, 2003

31

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Efficient time-domain vector fitting for broadband interconnect modelling

Se-Jung Moon,, Xiaoning Ye,, Cangellaris, A

Année:

2010

Langue:

english

Fichier:

PDF, 388 KB

english, 2010

32

Finite element modeling of electromagnetic wave interactions with periodic dielectric structures

Pinello, W.P., Lee, R., Cangellaris, A.C.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

1994

Langue:

english

Fichier:

PDF, 709 KB

english, 1994

33

[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - A novel graph partitioning technique for enhancing the computational efficiency of the loop-tree generalized PEEC modeling of 3D interconnects

Aosheng Rong,, Cangellaris, A.C., Limin Dong,

Année:

2005

Langue:

english

Fichier:

PDF, 2.55 MB

english, 2005

34

[IEEE 2010 10th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) - New Orleans, LA, USA (2010.01.11-2010.01.13)] 2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) - Modeling of substrate noise in monolithic integrated circuits

Manetas, George, Cangellaris, Andreas C.

Année:

2010

Langue:

english

Fichier:

PDF, 273 KB

english, 2010

35

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - A conformal mapping based approach for fast two-dimensional FEM electrostatic analysis of MEMS devices without re-meshing

Sumant, Prasad S., Cangellaris, Andreas C., Aluru, Narayana R.

Année:

2009

Langue:

english

Fichier:

PDF, 542 KB

english, 2009

36

[IEEE IEEE 1997 IEEE 1997 International Symposium on Electromagnetic Compatibility Symposium Record - Austin, TX, USA (18-22 Aug. 1997)] IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113) - Analysis of interconnect and package structures using PEEC models with radiated emissions

Pinello, W., Ruehli, A., Cangellaris, A.

Année:

1997

Langue:

english

Fichier:

PDF, 555 KB

english, 1997

37

[IEEE International Symposium on Electromagnetic Compatibility (EMC'98) - Denver, CO, USA (24-28 Aug. 1998)] 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253) - Prediction of differential- and common-mode noise in high-speed interconnects with the partial element equivalent circuit technique

Pinello, W.P., Cangellaris, A.C., Ruehli, A.

Année:

1998

Langue:

english

Fichier:

PDF, 555 KB

english, 1998

38

Experimental characterization of transmission lines in thin-film multichip modules

S. Lipa, M. Steer, A. Cangellaris, P. Franzon

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Année:

1996

Langue:

english

Fichier:

PDF, 634 KB

english, 1996

39

[IEEE 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Chicago, Il, USA (8-12 Aug. 2005)] 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Domain decomposition and multi-scale finite elements for electromagnetic analysis of integrated electronic systems

Cangellaris, A.C., Hong Wu,

Année:

2005

Langue:

english

Fichier:

PDF, 257 KB

english, 2005

40

[IEEE 2001 International Symposium on Electromagnetic Compatibility (EMC 2001) - Montreal, Que., Canada (13-17 Aug. 2001)] 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) - Transient analysis of printed circuit board problem using two different solvers

Ruehli, A., Papadopoulos, G., Aygun, K., Michielssen, E., Cangellaris, A.

Année:

2001

Langue:

english

Fichier:

PDF, 487 KB

english, 2001

41

[IEEE 2001 International Symposium on Electromagnetic Compatibility (EMC 2001) - Montreal, Que., Canada (13-17 Aug. 2001)] 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) - Investigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cables

Cangellaris, A.C., Coperich, K.M., Hao-Ming Huang,, Ruehli, A.

Année:

2001

Langue:

english

Fichier:

PDF, 616 KB

english, 2001

42

[IEEE International Symposium on Electromagnetic Compatibility (EMC'98) - Denver, CO, USA (24-28 Aug. 1998)] 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253) - Application of the partial element equivalent circuit (PEEC) method to realistic printed circuit board problem

Ruehli, A.E., Cangellaris, A.C.

Année:

1998

Langue:

english

Fichier:

PDF, 481 KB

english, 1998

43

[IEEE 2000 International Symposium on Electromagnetic Compatibility (EMC 2000) - Washington, DC, USA (21-25 Aug. 2000)] IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016) - Rigorous modeling of the frequency dependence of ohmic losses in high-speed electrical interconnections

Coperich, K.M., Cangellaris, A.C., Ruehli, A.E.

Année:

2000

Langue:

english

Fichier:

PDF, 582 KB

english, 2000

44

[IEEE Symposium on Electromagnetic Compatibility - Santa Clara, CA, USA (19-23 Aug. 1996)] Proceedings of Symposium on Electromagnetic Compatibility - Frequency-domain finite element methods for electromagnetic field simulation: fundamentals, state of the art, and applications to EMI/EMC analysis

Cangellaris, A.C.

Année:

1996

Langue:

english

Fichier:

PDF, 1.15 MB

english, 1996

45

Model-Order Reduction of Finite-Element Approximations of Passive Electromagnetic Devices Including Lumped Electrical-Circuit Models

Wu, H., Cangellaris, A.C.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2004

Langue:

english

Fichier:

PDF, 224 KB

english, 2004

46

Hybrid multilevel/multigrid potential preconditioner for fast finite element modeling

Yu Zhu,, Cangellaris, A.C.

Journal:

IEEE Microwave and Wireless Components Letters

Année:

2002

Langue:

english

Fichier:

PDF, 219 KB

english, 2002

47

An Approximation of the Electromagnetic Green's Function of Layered Media With the Source Point Considered as an Independent Variable

Proekt, L.B., Cangellaris, A.

Journal:

IEEE Transactions on Magnetics

Année:

2004

Langue:

english

Fichier:

PDF, 171 KB

english, 2004

48

A study of discretization error in the finite element approximation of wave solutions

Lee, R., Cangellaris, A.C.

Journal:

IEEE Transactions on Antennas and Propagation

Année:

1992

Langue:

english

Fichier:

PDF, 783 KB

english, 1992

49

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Distributed on-chip power grid modeling: an electromagnetic alternative to RLC extraction-based models

Jae-Yong Ihm,, Cangellaris, A.C.

Année:

2003

Langue:

english

Fichier:

PDF, 259 KB

english, 2003

50

Finite element modeling and multigrid preconditioner using adaptive triangular meshes

Yu Zhu,, An-Yu Kuo,, Cangellaris, A.C.

Journal:

IEEE Microwave and Wireless Components Letters

Année:

2006

Langue:

english

Fichier:

PDF, 181 KB

english, 2006